Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
by Yong Liu
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| Publisher: | Springer |
| Published In: | 17-Feb-2012 |
| ISBN-10: | 1461410525 |
| ISBN-13: | 9781461410522 |
| Binding Type: | Hardback |
| Weight: | 2.55 lbs |
| Pages: | pp. 612, 638 Illus. |
The Title "Power Electronic Packaging Design, Assembly Process Reliability and Modeling" is written by Yong Liu. This book was published in the year 2012. The ISBN number 1461410525|9781461410522 is assigned to the Hardback version of this title. This book has total of pp. xviii + 591 (Pages). The publisher of this title is Springer. We have about 138114 other great books from this publisher. Power Electronic Packaging Design, Assembly Process Reliability and Modeling is currently Available with us.