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SemiConductor Wafer Bonding Science and Technology 1st Edition

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SemiConductor Wafer Bonding Science and Technology 1st Edition,0471574813,9780471574811

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Book Information

Publisher:John Wiley & Sons
Published In:18-Dec-1998
ISBN-10:0471574813
ISBN-13:9780471574811
Binding Type:Hardback
Weight:1.58 lbs
Pages:pp. 320

The Title "SemiConductor Wafer Bonding Science and Technology 1st Edition" is written by Q.Y. Tong. This book was published in the year 1998. The ISBN number 0471574813|9780471574811 is assigned to the Hardback version of this title. The book displayed here is a 1st Edition edition. This book has total of pp. 320 (Pages). The publisher of this title is John Wiley & Sons. We have about 121738 other great books from this publisher. SemiConductor Wafer Bonding Science and Technology 1st Edition is currently Available with us.

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